Conformal Coating and Fluid Dispensing systems and equipment
Conformal Coating is the process of applying a protective material that through its coverage of a surface protects against various environmental factors.
In the case of electronic circuitries, it acts as protection against moisture, dust, and chemicals that if uncoated would result in excessive and premature failure rates of the device.
The combination of factors for the specific device depends upon the environment in which it’s intended to operate.
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MULTI MODE APPLICATOR: 3 MODES OPERATION
Ideal for applications that require spot coating, broad pattern widths, and thin film builds.
A stream of fluid is applied to the circuit board in areas where components are very close to non-coating or keep-out areas, or extra fluid is required for protection of high-impedance areas.
This pattern is created by controlling the fluid pressure and fluid flow passing through the nozzle. The monofilament pattern is ideal for dispensing broad pattern widths, while maintaining good edge definition, resulting in faster cycle times.
The film pattern is achieved by increasing air pressure and lowering flow settings. Angled jets impinge air upon the pressurized fluid exiting the nozzle creating a conical, swirling pattern. The mode is ideal for applications where moderate selective coating and thin film builds are required.
Specifically optimized to atomize coating fluids – delivering exceptional edge definition and thin, uniform coating thicknesses at increased speeds.
Improved air-assist efficiency allows for tight edge tolerance with increased selectivity and control near keep out zones for a wide range of materials varying in viscosity from 30 to 3500 mPa-sec.
Our valves offers precision and volumetric control. This application uses a standard dispensing needle designed to enable access around tall components. However, unlike standard needle valves that apply a continuous flow of the material, the valve is designed to jet discreet dots.
The jetting action reduces satellites and accelerates the material just enough so that it cleanly breaks off from the needle tip is also compatible with low viscosity materials that are typically less than 400 centipoise. When using solvent-based materials, film thicknesses of 15 micrometers can be achieved, depending on the material.
The key benefits of the film coater are the high speed and superior edge definition for selectively applying conformal coating materials with viscosities less than 100 centipoise.
Encapsulation of only FlipChip’s bottom side
Complete assembly encapsulation
DAM & FILL
Creating a closed wall around the component
Fixation DOTS to adhere components
Dispense solder paste over a PCB
Link de component to the heatsink
Sealing material on the edge of the encapsulator
Dispensing in any shape and any direction
Copyright by MSTECH EMEA, S.L.U. /// Developed by Graphe Disseny