Laser Depaneling Machine LS-NUN
Laser Depaneling Machine LS-NUN
Laser Depaneling Machine:Â Best cutting quality and excellent performance
- PCB board routing and cutting use Laser source
- Support hybrid type PCB board (FPCB, Rigid-Flex PCB)
- Minimize particles because of non-contact cutting
- High cutting quality compare on the contact type router (100um –> under 30 um)
- Support the complex shape PCB cutting
- Stress free, Form cut free, Tooling cost free
Features
- Use various Laser source as UV, Green, IR, etc.
- Cutting materials: FR4, FPCBs, Kapton, etc.
- Thickness up to 1.2mm in case of FR4 PCB
- Pin Table, Production fixture
- Full-cut process, Support high populated PCB panel
- Best cutting quality (minimize charring)
- Clean process of particle and fume removal
Options
- Hybrid cutting mixed drill bit and Laser
- AL. PCB, Ceramic PCB, etc.
- In-line Laser routing
- Recognizing the finger-print
Features
Options
Specifications
Layout
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Features
Options
Different types of lasers according to application:
LS-UTG: UTG (Ultra Thin Glass) Cutting Machine
Laser Type: IR Laser 20W
- Stage: 300 x 300 mm vacuum chuck
- Stress and crack free process
- Cutting Thickness: 30um ~ 100um
- Support Round Cutting
- Bending test: 1R, 400K
Different types of lasers according to application:
LS-QTZ: Quartz Tube Rod Cutting Machine
Laser Type: IR Laser
- Chip size: <30um
- No need Cleaning, Dry and fire polishing process
- Cutting Thickness: ~6T
- Stress, crack and particle free process
Different types of lasers according to application:
LS-WFR: Wafer Cutting Machine
Laser Type: UV Laser
- Cutting Thickness: ~800um
- Cutting width: <100um
- Chip size: <30um
- Stress and crack free process
- Hybrid cutting mixed drill bit and Laser
- AL. PCB, Ceramic PCB, etc.
- In-line Laser routing
- Recognizing the finger-print
Specifications
| Category | Item | Specification |
|---|---|---|
| Work area / Panel | Work area (X x Y, mm2) | 250 x 300 |
| Panel length (mm) | 300 | |
| Panel width (mm) | 250 | |
| Panel thickness (mm) | 0.1 to 1.6 (TBD) | |
| Scanner | Scan field (mm2) | 100 x 100 |
| Scan speed (mm/s) | 2,500 mm/s | |
| Readable codes | QR Code & Bar Code | |
| Laser | Laser Power (W) | 20 |
| Laser Wavelength (nm) | 355 | |
| Diameter of focused laser beam | ≤Ø50μm | |
| Accuracy | ≤±5μm | |
| Axis | Axis speed (X) | Max 1,000 mm/s |
| Axis speed (Y) | Max 1,000 mm/s | |
| Axis speed (Z) | Max 18 mm/s | |
| Axis Repeatability (X) | ≤±1μm | |
| Axis Repeatability (Y) | ≤±1μm | |
| Axis Repeatability (Z) | ≤±2μm | |
| Machine | Machine Size (W x H x D, mm) | 1250 x 2100 x 1700 |
| Weight | 2,800 Kg | |
| M/C Air | 0.7Mpa, 800L/min, Ø12 Tube | |
| M/C power supply | AC220V 1PH 50/60Hz 6.6Kw 30A |
Layout
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