Selective treatment and inline solutions with plasma technology
In thorough cleaning with Plasma Openair (plasma cleaning) solvents and additives are removed from the surface and the surface is gently and safely sterilized (plasma sterilization), while plasma activation provides subsequent adhesion of adhesives and coatings.
Atmospheric plasma technology facilitates the selective treatment of electronic components and can be fully integrated into standard inline processes. This reduces the process time while keeping costs down. The special nozzles work with a residual voltage of less than 0.7 V, which ensures the safe treatment of sensitive electronic devices.
Plasma activation provides efficient, precise, selective, permanent and environmentally friendly surface activation.
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Improved adhesion – Surface conditioning – Protection coatings – Conductive coatings – Selective treatment – High speed treatment – Potential-free – Cost-effective – Flexible – Environmentally friendly
Mobile Manufacturer – PCB Manufacturer – PCB Assembly – LED Manufacturer – Semi & Packaging – Flex Circuits – Display Manufacturer – Component Assembly
Improved adhesion: Printing, encapsulation, bonding, spray coating, multilayer
Surface conditioning: Removal of hydrocarbons, removal or improvement of oxides
Protection coatings: Corrosion protection, electrical isolation, barrier coatings
Conductive coatings: Selective conductive layer and shielding
Selective treatment posible
High speed treatment: up to 1,5m/sec
Potential-free: < 1V, can even be used on sensitive electronics
Cost-effective: Low investment and operating costs
Flexible: Can be configured to suit all surfaces (flat or 3D)
Environmentally friendly: Relies on compressed air. No solvent
Copyright by MSTECH EMEA, S.L.U. /// Developed by Graphe Disseny